17 days old

Photonics Packaging Engineer

Cisco Systems Inc.
Allentown, PA 18101
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Senior Photonics Packaging Engineer

What You'll Do:

Cisco is looking for a Silicon Photonics Packaging Engineer to lead Silicon Photonics chip packaging design and assembly process development for Cisco's optical transceiver products. You will work closely with internal and external teams to support and lead package design, substrate & PCB design, substrate manufacturing, package assembly, reliability and qualification. You will be the primary interface for package design, between external suppliers and internal design teams, as well as lead the fabrication, assembly, test and qualification of chip packages on substrates. You will work closely with multi-functional teams to provide guidance on correlation of package design & architecture to assembly & process constraints and help with solving issues and resolving yield and reliability problems as they come along. Any prior substrate design experience will be highly useful, albeit not necessary. A deep understand of substrate design rules and fabrication processes is important. Primary responsibilities include leading package design in collaboration with internal design teams, providing appropriate design rule decks and lead DFM/DFR activities, lead substrate fabrication, package assembly and package qualification with external partners and suppliers.

Who You'll Work With:

You will work in a highly collaborative, multi-functional environment that includes engineering, operations and supply chain teams to build next generation single and multi-mode photonics technologies within Cisco. You will also be working closely with a network of Cisco Fabs and OSAT supply chain to guide package design, assembly and manage quality issues. The role has a large scope, cross-organizational visibility and the potential to influence critical technology development, as well as influence commodity strategy for Cisco's various product platforms.

Who You Are:

  • BS/MS/PhD (graduate degree preferred) in Mechanical or Electrical Engineering, Physics, Materials Science or a similar field, preferably with a focus on package design, assembly processes, materials etc. with at least 3-5 years of experience.
  • Experience in substrate design and/or mechanical modeling is highly desired.
  • Understanding of package design & architecture, especially substrate design, fabrication, assembly and reliability is required.
  • Knowledge or experience in Silicon photonics packaging would be beneficial
  • Useful skills include the ability to solve assembly process issues, experience in 8D or model-based problem solving, knowledge of statistical process control, and data analysis skills.
  • Proven ability to work within a highly multi-functional and geographically distributed environment.
  • FCBGA substrate packaging experience a plus
  • Excellent communication, data presentation and influencing skills.

Why Cisco


#WeAreCisco, where each person is unique, but we bring our talents to work as a team and make a difference. Heres how we do it.

We embrace digital, and help our customers implement change in their digital businesses. Some may think were old (30 years strong!) and only about hardware, but were also a software company. And a security company. A blockchain company. An AI/Machine Learning company. We even invented an intuitive network that adapts, predicts, learns and protects. No other company can do what we do you cant put us in a box!

But Digital Transformation is an empty buzz phrase without a culture that allows for innovation, creativity, and yes, even failure (if you learn from it.)

Day to day, we focus on the give and take. We give our best, we give our egos a break and we give of ourselves (because giving back is built into our DNA.) We take accountability, we take bold steps, and we take difference to heart. Because without diversity of thought and a dedication to equality for all, there is no moving forward.

So, you have colorful hair? Dont care. Tattoos? Show off your ink. Like polka dots? Thats cool. 

Posted: 2021-02-10 Expires: 2021-03-13
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Photonics Packaging Engineer

Cisco Systems Inc.
Allentown, PA 18101
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