3 days old

IC Packaging Engineer-Substrate Engineering(Staff or Sr. Staff)

Qualcomm Inc.
新竹市, 300
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Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > ASICS Engineering

Job Overview:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

GENERAL SUMMARY

Qualcomm Packaging group is responsible for developing new package technologies and high volume manufacturing deployment for different product segments for mobile market & new emerging markets as IoT, Automotive, 5G. This team is responsible for road-map, working with OSATs, IC substrate suppliers, internal design and product teams as well as NPI. Team is looking for experienced packaging substrate engineer who has worked on substrate technologies

Responsibilities:

  • Responsible for advance new product development (FCBGA, FCCSP)
  • Responsible for IC substrate design rule set-up.
  • IC substrate supplier management for HVM capability improvement and quality control, trouble shooting.
  • Work with internal design team and drive DFM methodology for new technologies.
  • Technical program management to plan, execute and monitor complex process or product developments.

Minimum Qualifications

  • Bachelor's degree in Material Science, Chemical, Mechanical, Electrical Engineering or related field.

Preferred Qualifications

  • Master's in Material Science/Chemical/Mechanical/Electrical Engineering.
  • Over 12 years of hands on experience working in IC substrate manufacturing factory (FCBGA/FCCSP)
  • Hands on experience working on substrate material factory or semiconductor packaging environment.
  • Experience of development, high-volume manufacturing, troubling shooting of IC substrate (FCBGA/FCCSP)
  • Understanding of organic laminate manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component & board level reliability testing.
  • Experience of Technical program management to plan, execute, and monitor complex process or product developments.
  • Knowledge in DOE , control plan , FMEA and other statistical process control method.
  • Proficiency in material and characterization data analysis, and statistical data analysis.
  • Knowledge of reliability test methods and qualification procedure.
  • Six Sigma Green or Black belt a plus
  • Good oral and written communication skills, strong team player & project management skills.

PHYSICAL REQUIREMENTS:

  • Frequently transports between offices, buildings, and campuses up to mile.
  • Frequently transports and installs equipment up to 5 lbs.
  • Performs required tasks at various heights (e.g., standing or sitting).
  • Monitors and utilizes computers and test equipment for more than 6 hours a day.
  • Continuous communication which includes the comprehension of information with colleagues, customers, and vendors both in person and remotely.

Minimum Qualifications

Education:

Bachelors - Engineering, Bachelors - Science

Work Experiences:

5+ years ASIC design, verification, or related work experience.

Certifications:

Skills:

Preferred Qualifications

Education:

Bachelors - Computer Engineering, Bachelors - Computer Science, Bachelors - Electrical Engineering

Work Experiences:

1+ years of work experience in a role requiring interaction with senior leadership (e.g., Director level and above). ,2+ years experience with design verification methods. ,2+ years experience with scripting tools and programming languages. ,2+ years experience with architecture and design tools. ,8+ years ASIC design, verification, or related work experience.

Certifications:

Skills:

ASIC Verification, Matlab C, Multicore System-On-Chip (SoC), Perl Programming, Simulation Software

Applicants: If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email toaccommodationsupport

To all Staffing and Recruiting Agencies:Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

If you would like more information about this role, please contact Qualcomm Careers.


We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goalwe invent breakthrough technologies that transform how the world connects, computes, and communicates.

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Posted: 2021-06-11 Expires: 2021-07-12
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IC Packaging Engineer-Substrate Engineering(Staff or Sr. Staff)

Qualcomm Inc.
新竹市, 300

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